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Deposition of Thin Copper Films Using High-Temperature Plasma Flows on the Surface of Fe, V, and Ti Metals

Department: DNP (ОЯФ)
Year: 2025
DOI: DOI https://doi.org/10.3103/S1068335625602389
REFERENCES: Eriskin, A., Kolokoltsev, V., Sprygin, G. et al. Deposition of Thin Copper Films Using High-Temperature Plasma Flows on the Surface of Fe, V, and Ti Metals. Bull. Lebedev Phys. Inst. 52, 496–506 (2025).

A.A. Eriskin, P.V. Silin, V.Ya. Nikulin, E.N. Peregudova (Lebedev Physical Institute, Russia); V.N. Kolokoltsev, G.S. Sprygin (Baikov Institute of Metallurgy and Materials Science, Russia); A.M. Mezrin (Ishlinsky Institute for Problems in Mechanics, Russia); A.I. Gaidar (Research Institute of Advanced Materials and Technologies, Russia); L.H. Khiem (Institute of Physics, Vietnam)